Bosch Biscuit on Pile packaging system August 3, 2017 At PACK EXPO Las Vegas 2017, Bosch Packaging Technology will launch its flexible Biscuit on Pile packaging system for plain, sweet and savory biscuits in North America. Read More
Biscuit packaging system August 10, 2015 Bosch Packaging Technology will introduce its Two-in-One biscuit packaging system to the North American market at PACK EXPO Las Vegas 2015.Read More
